Thin Wafer Processing and Dicing Equipment Market to Expand at a CAGR of 6.80% by 2024-end due to Growing Penetration of Advanced Technologies
Transparency Market Research (TMR) estimates that the global thin wafer processing and dicing equipment market has a highly consolidative landscape. Disco Corp. accounted for largest share of 56.4% in 2015 and likely to be dominant in the coming years. This is creating monopoly in the thin wafer processing and dicing equipment market in terms of competitive presence. The other key players such as EV Group, Plasma-Therm LLC, Lam Research Corp, Advanced Dicing Technologies, and Tokyo Electron Ltd. are operating in the global thin wafer processing and dicing equipment market.
According to TMR, the global thin wafer processing and dicing equipment market is likely to expand at a CAGR of 6.80% over the forecast period to attain a value of US$692.5 mn by 2024-end. The market had acquired a value of US$388.9 mn in 2015.
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Investment for Improvement in Wafers to Offer Lucrative Opportunities
Further, growing advancements and lowering size of the wafers is boosting its application across chemical mechanical polishing (CMP). The wafers are increasingly integrated into processing mainly to the high-quality flat surface of the wafer. This is propelling growth of the global thin wafer processing and dicing equipment market. Nonetheless, growing investments for improvement in deposition systems and multiple designs from customers of numerous sectors is offering lucrative opportunities for growth of the thin wafer processing and dicing equipment market. Manufacture of the technologies based on radio frequency (RF) devices supporting to 4G and 5G wireless infrastructure is expected to offer opportunities for growth over the forecast period.