Flip Chip Technology Market Report 2019 analyses Samsung, Intel, Global Foundries, UMC these Top Players
This report on Global Flip Chip Technology Market details about the market size, market growth rate and global forecast for the next five years i.e. 2024. The report is a complete analysis assessing the pricing trends, market consumption and sales forecasts. This study covers the competitive landscape by profiling the major market players. The vital information of the market is collected through authentic sources and reviewed by industry experts.
In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
The worldwide market for Flip Chip Technology is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019.
This report focuses on the Flip Chip Technology in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
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Market Segment by Manufacturers, this report covers
- Global Foundries
- STATS ChipPAC
- Texas Instruments
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- FC BGA
- FC PGA
- FC LGA
- FC QFN
- FC SiP
- FC CSP
Market Segment by Applications, can be divided into
- Consumer electronics
- Industrial sector
- Medical devices
- Smart technologies
- Military & aerospace
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The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Flip Chip Technology product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Flip Chip Technology, with price, sales, revenue and global market share of Flip Chip Technology in 2017 and 2018.
Chapter 3, the Flip Chip Technology competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Flip Chip Technology breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Flip Chip Technology market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Flip Chip Technology sales channel, distributors, customers, research findings and conclusion, appendix and data source.
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